PCBA Capability
| | Normal FR4,Normal Tg FR4(Halogen free),High Tg FR4(Halogen free),HDI PCB material |
| | Rigid pcb(Backplane,HDI,High multi-layer blind&buried PCB,Embedded Capacitance) |
| | Blind&buried via type,HDI PCB |
| | Lead free,Leaded,aspect ratio,Max finished size,MIN finished size, PCB thickness, MAX high to gold finger |
Plating/coating thickness | Tin thickness,OSP, ENIG, Immersion Silver,Immersion Tin,Hard gold, Soft gold |
| | MAX thickness of mechanical hole 4mil/6mil/8mil,Min/Max laser drilling size,Finshed mechanical hole size |
| | Min Pad size for laser drillings,Min Pad size for mechanical drillings,Min BGA pad size,Pad size tolerance(BGA) |
| | MAX drilling tool size for via filled with Soldermask (single side) |
| | Min gap between mechanical hole wall and conductor (Local mixed pressure area) |
| | Layer counts,PCB size (Finished),MAX PCB size(Ceramic-substrate PCB),PCB thickness(Finished) |
| | Min space of the V-CUT does not reveal the copper ( Central Line of v-cut to internal/external circuits,H means board thickness) |
Trusted and Reliable
Many of our customers have entrusted us to work with them on their NPI/Prototype needs and then to successfully transition those new projects to production volumes.
Our NPI process ensures that your NPI requirements will be managed and built by the same Electronic Solutions Teams and Equipments that will build your production volumes. This allows for a value added process that ensures a high quality and cost effective product for you.
Accountability and superior customer satisfaction is provided by nothing being lost in the transition from the NPI/Prototype process to the higher volume production process.
FAQ:
Q1. How to you make the impedance calculation?
The impedance control system is done using some test coupons, the SI6000 soft and the CITS 500s equipment from POLAR INSTRUMENTS.
The equipment measures the impedance on a representative track configuration coupon of which the client has given us a determinate value and tolerance.
Q2. What kind of PCB file format can you accept for production?
Gerber, PROTEL 99SE, PROTEL DXP, CAM350, ODB+(.TGZ)
Q3. How do we ensure quality?
Our high quality standard is achieved with the following.
1. The process is strictly controlled under ISO 9001:2008 standards.
2. Extensive use of software in managing the production process
3. State-of-art testing equipments and tools. E.g. Flying Probe, X-ray Inspection, AOI (Automated Optical Inspector) and ICT (in-circuit testing).
4. Dedicated quality assurance team with failure case analysis process
5. Continuous staff training and education
Q4. How can we guarantee you receive an good quality product?
For PCB, we will use Flying Probe Test, E-test etc. for it.
For PCBA, we need you to offer us a method or test fixture for the function test.Before that, our inspectors will use microscope and X-ray to check the IC footwelding or bad solder etc.
Q5. What’s the key equipments for HDI manufacturing?
Key equipment list is as following: Laser drilling machine, Pressing machine, VCP line, Automatic Exposing machine, LDI and etc.
Q6. What’s the typical process flow for multi-layer PCB?
Material cutting → Inner dry film → inner etching → Inner AOI → Multi-bond→ Layer stack up Pressing → Drilling → PTH → Panel Plating → Outer Dry Film → Pattern Plating → Outer etching → Outer AOI → Solder Mask → Component Mark → Surface finish → Routing → E/T → Visual Inspection.
